EDN3d
Data center solutions take center stage at APEC 2025
This year during APEC, much of the focus revolved around data center power solutions from PSUs and BBUs to IBCs and GPU power ...
New Electronics12d
Infineon presents high-density power modules for VPD in AI data centres
The TDM2454xx modules are a fusion of Infineon's OptiMOS 6 trench technology, its chip-embedded packaging for enhanced ...
Electronics Weekly10d
Embedded World 2025: Get the full Electronics Weekly Guide
Embedded World: PIC32 with high-end analogue Microchip adds high-performance analogue blocks to its PIC32 MCUs: 12bit ...
Design-Reuse13d
EEMBC Publishes Benchmark Scores for Infineon Technologies' Carmel DSP Core And TriCore TC11IB Microcontroller
EL DORADO HILLS, Calif., March 13 /PRNewswire/ -- EEMBC, the Embedded Microprocessor Benchmark Consortium, today announced that it has published EEMBC benchmark scores for Infineon Technologies' (NYSE ...
Electropages10d
Next-gen high-density power modules for VPD in AI data centres
Infineon Technologies AG offers the next generation of high-density power modules which play a pivotal role in enabling AI and high-performance compute. The new OptiMOS TDM2454xx quad-phase power ...