Arm has introduced a series of developer tools and services designed to support rapid migration of x86 apps to Arm architecture ...

A new contest inspired by Google's Zentool challenges developers to modify AMD Zen CPU microcode to run RISC-V programs ...

Arm expects to see its architecture account for half of the datacenter CPU market by the end of this year, up from 15 percent in 2024, all thanks to the AI boom. The Brit chip designer has long touted ...

In many cases, Arm's technology offers lower power consumption than processors made by Intel (INTC) and Advanced Micro Devices (AMD), said Awad to Reuters. Awad noted that data center chips often ...

Arm's tech in many cases offers lower power consumption than rival processors made by Intel and Advanced Micro Devices, Mohamed Awad, Arm's infrastructure chief, told Reuters. As AI data centers use ...

Arm's tech in many cases offers lower power consumption than rival processors made by Intel and Advanced Micro Devices, Mohamed Awad, Arm's infrastructure chief, told Reuters. As AI data centers ...

Summary The Cortex-A9 and Cortex-A9 MPCore are two new ARM processors designed to address the requirements for both single and multiple processor designs. The common microarchitecture incorporates ...

Qualcomm Inc. has launched a global antitrust campaign against Arm Holdings Plc as the two longtime business partners jockey for advantage in the computing semiconductor market. In private ...

That said, the highest you can go with an LGA 1151 socket is the i9-9th generation CPUs, and those processors were reigning at their times and can still handle most modern-day workloads – if you ...

The Surface Laptop 7 models in question have Qualcomm's Snapdragon X Elite processors, which are based on an ARM architecture. Compatibility issues are the main cause of the returns. The ...

Google Drive is now available on Arm-based Windows PCs, beginning March 24, 2025 with a 15-day rollout. ARM64 computing continues gaining traction, making Windows on Arm a viable choice for ...

HBM—essentially a 3D structure of vertically stacked DRAM dies on top of a logic die—relies on advanced packaging technologies like through silicon vias (TSVs) while using a silicon interposer for ...