The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

If they were positioned too close together, they tended to fuse together during the soldering process ... solder balls directly on the semiconductor substrate, smaller solder balls were mounted on top ...

After years of admiring kei vans on the streets of Japan and wishing I had one to drive at home in Colorado, I took the ...

As developers push the boundaries of motion control, edge computing and mobile energy storage, the SCHURTER UHP fuse provides ...

A new series of high-power fuses from Bourns offers enhanced voltage and current ratings that comply with the gPV protection ...

Tripp Lite’s Protect It 12-Outlet Surge Protector TLP1208SAT absorbs thousands of volts so they won’t fry your gear, and it helpfully lets you know when its protection wears out.

In recent years, the requirement of compact devices caused an increasing use of Surface Mount Technology. This technology guarantees the reduction of the size of electronic packages by exploiting ...

Nine broad use categories are classified for electronic assemblies which are subjected to varying thermal environments during their operational life, and worst-case, but realistic, temperature ...