A new series of high-power fuses from Bourns offers enhanced voltage and current ratings that comply with the gPV protection ...

If they were positioned too close together, they tended to fuse together during the soldering process ... solder balls directly on the semiconductor substrate, smaller solder balls were mounted on top ...

Nine broad use categories are classified for electronic assemblies which are subjected to varying thermal environments during their operational life, and worst-case, but realistic, temperature ...

In recent years, the requirement of compact devices caused an increasing use of Surface Mount Technology. This technology guarantees the reduction of the size of electronic packages by exploiting ...