Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

A new technical paper titled “Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling” ...

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare ...

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

At GTC 2025, Nvidia CEO Jensen Huang projected $1 trillion in global data center CapEx by 2028. At this pace, data center ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly. Todd Bermensolo, product ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor ...

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization ...