With custom chips and billions in investment, this high-stakes infrastructure battle could shape the future of AI.

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today officially unveiled its new fab ...

TSMC is reportedly planning to start production of advanced chips in the US, as it recently announced $100 billion investment ...

Intel does not manufacture in Japan but collaborates with Japanese firms and research institutions like AIST and Riken, ...

A world-first N-polar GaN wafer created by Chinese scientists is set to be a game changer for the semiconductor industry A breakthrough in next-generation semiconductor technology has been announced ...

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is in discussions with the White House over potential US tariffs on ...

Changing semiconductor tariffs are reshaping business models. See why U.S. fabs could offer an edge for companies like Intel ...

SMIC released its fourth-quarter and full-year 2024 financial results on March 27, reporting record revenue and wafer ...

The EUV lithography Market report, unveiled by Future Market Insights—an ESOMAR Certified Market Research and Consulting Firm—presents invaluable insights and meticulous analysis of the EUV ...

An analyst from TechInsights suggests that TSMC's chip production cost in the US is only slightly higher than in Taiwan.

K&S has separately announced the concurrent launch of Asterion ® -PW, extending its leadership in power device applications with a fast and precise ultrasonic pin welding solution. This advanced ...