AMD is proud to announce its deep partnership with TSMC, with its next-gen EPYC 'Venice' CPU the first HPC chip made on ...

mirai features the following core integrations, with usage examples in the linked vignettes: Provides an alternative communications backend for R, implementing a new parallel cluster type, a feature ...

Fundamental analysis highlights concerns over Intel's ability to meet production goals and revive its server processor business. The company's EBITDA may see only a minor uptick – around 5% ...

For a quick refresher, Panther Lake is the name of Intel’s next-gen mobile CPUs that will end up in laptops (and other devices). These will most likely fall under the Core Ultra 300 series ...

“All of the R&D work of TSMC is in Taiwan, and they haven’t made any announcements to move that.” The former Intel chief added ... and that its core research and development will remain ...

Google completes March 2025 Core Update rollout after two weeks of implementation across search results worldwide. Google's March Core Update is finsihed rolling out. The rollout took two weeks to ...

Intel is planning a refreshed lineup of new Intel gaming CPUs aimed at gaming enthusiasts, according to a new rumor. The Intel Arrow Lake refresh will apparently deliver new overclockable K and KF ...

The ARM9E family of processors has been successfully used for many years in a wide range of applications, including hard disk drives, imaging, automotive, networking and wireless devices. Their low ...

“Our MIPS I6500 CPU sets a new standard for scalable, heterogeneous many-core designs, providing the ideal solution for the EyeQ®5 SoC. We are focused on delivering ever more innovative IP solutions ...

The reticulate package provides a comprehensive set of tools for interoperability between Python and R. The package includes facilities for: Calling Python from R in a variety of ways including R ...

HBM—essentially a 3D structure of vertically stacked DRAM dies on top of a logic die—relies on advanced packaging technologies like through silicon vias (TSVs) while using a silicon interposer for ...

The scientists said that the new transistor could be integrated into chips that could one day perform up to 40% faster than the best existing silicon processors made by U.S. companies like Intel.