TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management ...

Apple chipmaker TSMC says that it will make chips with a sub-2nm process size for the first time ever in 2028, and that the development of 1.4nm chips will allow for greater AI capabilities.

Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in ...